High Performance Networking Infrastructure at Scale
OFC 2026
March 17–19, 2025
Los Angeles, CA | Booth #1571
Join Arista Networks at OFC 2026
Visit us at Booth #1571 to explore:
Demo #1
Dense 1.6Tbps for Next-Gen AI Centers
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102.4 Tbps Switch | High density 4RU switch - leveraging 3nm technology
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The demonstration showcases the next generation of high-performance connectivity, featuring support for cutting-edge 200G-per-lane 1.6Tbps Linear Pluggable Optics (LPO), Linear Receive Optics (LRO) Fully Retimed Optics (FRO), It highlights seamless interoperability between advanced 1.6T optics and gearbox-based 800G optics, enabling flexible, scalable, and future-ready forward compatible network deployments.
Demo #2
Coherent Solution for Scale Across, DCI, Metro and Long Haul
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Arista’s DCI solution with a simplified Pluggable Optics Line System (POLS).
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The demonstration features 100G-ZR, 400G-ZR, and 800G-ZR channels transmitted over a single fiber using a passive MUX and a QSFP28 dual-amplifier pluggable module capable of covering the full C-band. The configuration integrates Optical Time Domain Reflectometer (OTDR) and Optical Channel Monitoring (OCM) modules, also in QSFP28 form factors.
Demo #3
12.8Tbps XPO Module with 64 Channels @ 200Gbps/λ
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Features a live demonstration of a prototype liquid cooled switch that contains liquid cooled eXtra Dense Pluggable Optics XPO modules. It also showcases modules, connectors and components from several members of the newly established XPO MSA.
Event Sessions
Sunday, March 15th
16:00 - 18:30
Workshop: How Far is Too Far? Interconnect Latency and Distributed AI Training
Artificial intelligence? Generalized intelligence? Superintelligence? Delivering on this promise requires ever larger models, enormous training datasets, and millions of GPUs. Distributed training enables workloads to be spread over large geographic regions, separated by hundreds or even thousands of kilometers. Novel networks are being introduced to interconnect these compute clusters, resolving power density problems, but introducing new challenges such as restricted bandwidth, network latency, transceiver complexity, and power dissipation.
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Hugh Holbrook
Chief Development Officer
16:00 - 18:30
Is CPO Integration Ready for AI Pipelines?
CPO has been an exotic communication paradigm for over a decade now, and now appears to be in the early stages of deployment by a few large companies and a few start-ups. The integration of CPO with ASICs offers a direct way for digital data to access the fiber without going through power-hungry and expensive electronic-to-optical conversion modules (i.e. pluggable optics).
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Vijay Vusirikala
Distinguished Lead - AI Systems and Networks
Monday, March 16th
8:50 - 10:10
Scale Across Data Center Networks - Program I Optica
Vijay Vusirikala
Distinguished Lead - AI Systems and Networks
16:30 - 17:40
Scale Up Data Center Networks - Program I Optica
Andy Bechtolsheim
Founder and Chief Architect
Tuesday, March 17th
10:30 - 11:30
IEEE Presents The Network and System Implications of CPO/NPO/xPO and the New Photonics Ecosystem for AI/ML Interconnects
The explosive investment in AI/ML infrastructure has led to significant growth in data center optics, starting with the evolution of scale-out interconnects to 200G PAM4 per channel, and the increasing interest in system integration of CPO/NPO/LPO/TRO and new, capacity and density (e.g., 64 lanes) pluggables. This CPO/xPO evolution is also combined with a new photonics technology ecosystem optimized for AI/ML interconnects, which aims to lower power, latency, and cost, and also enable scale-up domains beyond copper interconnects, as discussed in the OFC 2025 IEEE panel.Learn More >
Sunil Priyadarshi
Senior Director, AI Hardware Architecture
14:15 - 15:45
Recent Advances in AI Cluster Interconnects
AI's explosive growth is driving unprecedented innovation in cluster networking. This session will highlight the latest breakthroughs and investments shaping AI-focused infrastructure - from next-generation switches and co-packaged optics (CPO) to GPU boards, optical circuit switches (OCS) and high-performance transceivers. Industry experts at the forefront of AI-related product development will share insights on emerging technologies, market drivers and the road ahead for scaling AI clusters. Learn More >
Andy Bechtolsheim
Founder and Chief Architect
16:00 - 17:00
Future Photonics for AI: From PICs to Pods to Factories
This updated panel from last year’s OFC50 hit discussion on “Lighting the Path to Exascale AI” will delve into the optical technologies and market dynamics essential for next-generation AI data center infrastructure. The race to exascale AI and beyond drives a fundamental shift in how AI factory building blocks are designed and operated, with photonics as a critical enabler. The future of optical communication must address some of the most pressing hurdles and bottlenecks, moving beyond traditional electronic interconnects. Learn More >
Andy Bechtolsheim
Founder and Chief Architect
16:30 - 18:30
Symposia: Next Generation Interconnects for AI Scale Up Systems
This symposium discusses the latest trends and advancements in photonic technologies for AI scale-up systems such as VCSELs, Silicon photonics, and other emerging technologies, as well as packaging techniques such as co-packaged optics (CPO), on-board optics (OBO) and pluggable optics (LPO/LRO) for low-power solutions.Learn More >
Vijay Vusirikala
Distinguished Lead - AI Systems and Networks